What is dynamic cooling?

Dynamic Temperature Control Systems are capable of rapid changes in temperature to correspond to changes in wafer processing temperatures. With dynamic systems, the temperature of the fluid supplied to the chamber is managed to compensate for changing processing conditions, so the temperature of the wafer chuck can be maintained in a narrow range.

These systems have the ability to sense chamber temperature drifts and compensate faster and more precisely than a conventional (remotely located) static compressor-based systems.