Point-of-Use Thermoelectric Chiller Applications
In the mid-1990s, prior to joining LAUDA DR. R. WOBSER GMBH & CO. KG, Noah Precision introduced the Point-of-Use (POU) chiller system. Its modular design concept was quickly embraced by Semiconductor IDM's and recognized as a viable alternative to conventional, compressor-based chillers. This remarkable system, offering a small form factor, low Cost-of-Ownership and Dynamic Temperature Control offered process and equipment engineers a new tool to optimize their temperature sensitive processes.
Today, LAUDA-Noah Temperature Control Systems are installed on more than sixty (60) different applications at over fifty (50) wafer fabs, worldwide.
The information below is categorized by semiconductor process and tool manufacturer. Each table includes an Applications Matrix that shows qulified and commercial processes.
Applied Materials®
| Chambers | Platforms | Process (Loops) | Temp range | Typical Temp | POU Module(s) |
|---|---|---|---|---|---|
| ASP(+) | Centura 5200 - Centura 2 & 300mm | Strip (Wall) | 20 - 80 °C | 60°C | S2400, 3300 |
| DPS DPS II | Centura 5200 - Centura 2 & 300mm | Si (Cathode) | 20 - 60 °C | 55°C | 3300 |
| DPS DPS II | Centura 5200 - Centura 2 & 300mm | Si (Wall) | 20 - 90 °C | 80°C | 3300 |
| DPS DPS II | Centura 5200 - Centura 2 & 300mm | Metal (Cathode) | 20 - 60 °C | 45°C | 3300 |
| DPS DPS II | Centura 5200 - Centura 2 & 300mm | Metal (Wall) | 20 - 90 °C | 80°C | 3300 |
| DPS DPS II | Centura 5200 - Centura 2 & 300mm | Nitridation (Cathode) | 20 - 90 °C | 80°C | 3300 |
| DPS DPS II | Centura 5200 - Centura 2 & 300mm | Nitridation (Wall) | 20 - 90 °C | 65°C | 3300 |
| eMax eMax(CT) | Centura 5200 - Centura 2 & 300mm | Oxide (Cathode) | 0 - 80 °C | 20°C | 3300, 3500 |
| eMax eMax(CT) | Centura 5200 - Centura 2 & 300mm | Oxide (Liner) | 20 - 80 °C | 40°C | 3300 |
| HART(+) HART 3 | Centura 300mm | Si - Dt (Cathode-Lid) | 20 - 80 °C | 50 & 75°C | 3300, 3500 |
| HART(+) HART 3 | Centura 300mm | Si - Dt (Wall) | 20 - 80 °C | 60°C | 3300 |
| HART(+) HART 3 | Centura 300mm | Si - Dt (Cathode-In/Out) | 20 - 105 °C | 80 & 90°C | 3300 |
| HART(+) HART 3 | Centura 300mm | Si - Dt (Wall) | 20 - 90 °C | 60°C | 3300 |
| HeWEB/WxP | P5000 - Centura 5200 - Centura 2 | Tungsten (Cathode) | 20 - 60 °C | 60°C | 3300 |
| HeWEB/WxP | P5000 - Centura 5200 - Centura 2 | Tungsten (Wall) | 20 - 80 °C | 60°C | 3300 |
| MxP(+) eMxP+ | P5000 - Centura 5200 - Centura 2 | SI (Cathode) | 10 - 60 °C | 40°C | 3300 |
| MxP(+) eMxP+ | P5000 - Centura 5200 - Centura 2 | Si (Wall) | 20 - 65 °C | 60°C | 3300 |
| MxP(+) eMxP+ | P5000 - Centura 5200 - Centura 2 | Metal (Cathode) | 10 - 60 °C | 40°C | 3300 |
| MxP(+) eMxP+ | P5000 - Centura 5200 - Centura 2 | Metal (Wall) | 20 - 90 °C | 60°C | 3300 |
| MxP(+) eMxP+ | P5000 - Centura 5200 - Centura 2 | Oxide (Cathode) | 0 - 60 °C | 20°C | 3300 |
| MxP(+) eMxP+ | P5000 - Centura 5200 - Centura 2 | Oxide (Wall) | 20 - 60 °C | 40°C | 3300 |
| PVD | Endura 5500 - Endura 2 (300mm) | Al • TiN (Platen) | -20 - 95 °C | 20°C | 3300, 3500 |
| Semitool | Raider | B S Clean (Chem Tank) | 10 - 50 °C | 20°C | 3300, 3500 |
| Semitool | Raider | B S Clean (IPA Loop) | 10 - 50 °C | 18°C | 3300 |
| Super e | Centura 5200 - Centura 2 | Oxide (Cathode) | -20 - 40 °C | 15°C | 3300, 3500 |
| Super e | Centura 5200 - Centura 2 | Oxide (Wall) | 0 - 60 °C | 15°C | 3300 |
Lam Research®
| Chambers | Platforms | Process (Loops) | Temp range | Typical Temp | POU Module(s) |
|---|---|---|---|---|---|
| 4400 4400XLe™ | Standalone - Alliance | SI (Upper electrode) | 10 - 60 °C | 30°C | 3300 |
| 4400 4400XLe™ | Standalone - Alliance | SI (Lower electrode) | 10 - 60 °C | 30°C | 3300 |
| 4500 4500i 4500XLe™ | Standalone - Alliance | Oxide (Upper electrode) | 10 - 60 °C | 30°C | 3300 |
| 4500 4500i 4500XLe™ | Standalone - Alliance | Oxide (Lower electrode) | -20 - 40 °C | 10°C | 3300, 3500 |
| 4700 4700X18™ | Standalone - Alliance | Metal (Upper electrode) | 10 - 80 °C | 40°C | 3300 |
| 4700 4700X18™ | Standalone - Alliance | Metal (Lower electrode) | 0 - 60 °C | 20°C | 3300 |
| DSiE | Standalone - Alliance | SI (MEMS) (Lower electrode) | 0 - 60 °C | 20°C | 3300 |
| Exelan ® (HPT/Flex) | Alliance - 2300 - 2300 Domino | Oxide (Upper electrode) | 0 - 40 °C | 30°C | 3300, 3500 |
| Exelan ® (HPT/Flex) | Alliance - 2300 - 2300 Domino | Oxide (Lower electrode) | -10 - 60 °C | 20°C | 3300, 3500 |
| Kiyo / Kiyo 45 | 2300 - 2300 Domino | SI (Lower electrode) | -20 - 70 °C | 20°C | 3300, 3500 |
| TCP® 9100 | Alliance | Oxide (Lower electrode) | 0 - 40 °C | 10°C | 3300, 3500 |
| TCP® 9400 | Standalone - Alliance | Si (Lower electrode) | 0 - 60 °C | 20°C | 3300 |
| TCP® 9600 | Standalone - Alliance | Metal (Lower electrode) | 20 - 70 °C | 60°C | 3300 |
| Versys (& tunable) | 2300 - 2300 Domino | SI (Lower electrode) | 10 - 80 °C | 20°C | 3300 |
| Versys (& tunable) | 2300 - 2300 Domino | Metal (Lower electrode) | 20 - 80 °C | 60°C | 3300 |
Mattson
| Chambers | Platforms | Process (Loops) | Temp range | Typical Temp | POU Module(s) |
|---|---|---|---|---|---|
| ICPsm | Aspen II (200mm) | Strip Poly (Platen) | 40 - 80 °C | 60°C | 3300 |
| Alpine | Aspen III (300mm-BE) | Strip (Platen) | 20 - 80 °C | 25°C | 3300 |
| eHighlands | Aspen III (300mm-FE) | Strip Poly (Platen) | 20 - 80 °C | 25°C | 3300 |
Novellus
| Chambers | Platforms | Process (Loops) | Temp range | Typical Temp | POU Module(s) |
|---|---|---|---|---|---|
| Iridia | PEP (200mm) | Surface Prep (Platen) | 20 - 90 °C | 70°C | 3300 |
| Sierra | Sierra (300mm) | Surface Prep (Platen) | 20 - 80 °C | 60°C | 3300 |
TEL™
| Chambers | Platforms | Process (Loops) | Temp range | Typical Temp | POU Module(s) |
|---|---|---|---|---|---|
| DRM | Unity® II(e) - Unity® M(e) -TELIUS (SP) | Oxide (Bottom electrode) | -20 - 70 °C | 40°C | 3300, 3500 |
| DRM | Unity® II(e) - Unity® M(e) -TELIUS (SP) | DT (Bottom electrode) | 20 - 105 °C | 90°C | 3300 |
| SCCM | Unity® II(e) - Unity® M(e) -TELIUS (SP) | Poly (Top electrode) | 20 - 105 °C | 60°C | 3300 |
| SCCM | Unity® II(e) - Unity® M(e) -TELIUS (SP) | Poly (Bottom electrode) | -20 - 80 °C | 20°C | 3300, 3500 |
| SCCM | Unity® II(e) - Unity® M(e) -TELIUS (SP) | Oxide (Top electrode) | 20 - 105 °C | 60°C | 3300 |
| SCCM | Unity® II(e) - Unity® M(e) -TELIUS (SP) | Oxide (Bottom electrode) | -20 -60 °C | 10°C | 3300, 3500 |